DocumentCode :
2535813
Title :
Design evaluation of shock induced failure mechanisms of MEMS by correlation of numerical and experimental results
Author :
Naumann, M. ; Lin, D. ; Mehner, J. ; McNeil, A. ; Miller, T.F.
Author_Institution :
Dept. of Microsyst. & Precision Eng., Chemnitz Univ. of Technol., Chemnitz, Germany
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
2891
Lastpage :
2894
Abstract :
The paper presents a novel approach to evaluate and improve MEMS reliability even during design phase of new devices. Firstly, the shock induced failure mechanisms of breakage and stiction are characterized by test structures. The obtained results in terms of maximum rated loads are compared to acting loads during the actual mechanical shock, which are calculated by a numerical impact model. The model is based on the modal superposition approach and can be applied to arbitrary designs. It accounts for impacts at flexible travel stops including stiction as well as for large structural deflections leading to strongly nonlinear squeeze damping.
Keywords :
damping; failure (mechanical); micromechanical devices; stiction; MEMS; breakage; mechanical shock; modal superposition approach; nonlinear squeeze damping; numerical impact model; shock induced failure mechanism; stiction; structural deflection; Damping; Electric shock; Equations; Load modeling; Mathematical model; Micromechanical devices; Reliability; MEMS; ROM; Reliability; Shock;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969564
Filename :
5969564
Link To Document :
بازگشت