DocumentCode
2535813
Title
Design evaluation of shock induced failure mechanisms of MEMS by correlation of numerical and experimental results
Author
Naumann, M. ; Lin, D. ; Mehner, J. ; McNeil, A. ; Miller, T.F.
Author_Institution
Dept. of Microsyst. & Precision Eng., Chemnitz Univ. of Technol., Chemnitz, Germany
fYear
2011
fDate
5-9 June 2011
Firstpage
2891
Lastpage
2894
Abstract
The paper presents a novel approach to evaluate and improve MEMS reliability even during design phase of new devices. Firstly, the shock induced failure mechanisms of breakage and stiction are characterized by test structures. The obtained results in terms of maximum rated loads are compared to acting loads during the actual mechanical shock, which are calculated by a numerical impact model. The model is based on the modal superposition approach and can be applied to arbitrary designs. It accounts for impacts at flexible travel stops including stiction as well as for large structural deflections leading to strongly nonlinear squeeze damping.
Keywords
damping; failure (mechanical); micromechanical devices; stiction; MEMS; breakage; mechanical shock; modal superposition approach; nonlinear squeeze damping; numerical impact model; shock induced failure mechanism; stiction; structural deflection; Damping; Electric shock; Equations; Load modeling; Mathematical model; Micromechanical devices; Reliability; MEMS; ROM; Reliability; Shock;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969564
Filename
5969564
Link To Document