• DocumentCode
    2536202
  • Title

    The use of regression experimental design to study some factors effecting the curing process of an epoxy resin

  • Author

    Fouracre, R.A. ; Fu, Lin

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
  • fYear
    1988
  • fDate
    12-16 Sep 1988
  • Firstpage
    539
  • Abstract
    A regression experimental design has been used to study the effects of temperature, curing time, and ratio of resin to hardener on the cure of an epoxy resin. It was found that these parameters can be used to characterize the resin using a second-degree polynomial to define the cure state. Important characteristics could be derived from this polynomial. An advantage of the method is that it needs far fewer sets of measurements to fully characterize the system with respect to the influence of several variables than the factorial design and regression methods taken separately. The method lends itself to the use of a microcomputer for both regression analysis and the prediction of curing parameter values for specific conditions, and minimizes the amount of experimental work required to obtain the characterization. An analysis of experimental results is presented
  • Keywords
    materials preparation; organic insulating materials; polymers; curing; epoxy resin; hardener; microcomputer; regression analysis; regression experimental design; resin; second-degree polynomial; temperature; Curing; Design for experiments; Dielectrics and electrical insulation; Encapsulation; Epoxy resins; Equations; Loss measurement; Polynomials; Regression analysis; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1988. Proceedings., Second International Conference on Properties and Applications of
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/ICPADM.1988.38452
  • Filename
    38452