Direct pick and place of CNT bundles for strain sensing applications

We have successfully demonstrated the direct pick and place of CNT bundles from a CNT growth substrate to a working specimen for strain sensing applications. The whole assembly process can take as little as one minute by manual operation under a probe station. A strain sensor based on CNT bundles has been constructed by adding electrical contacts. Experimental results show 2.1% relative resistance change of CNT bundles under a 0.18% strain with good stability. As such, the established assembly process can be a practical way to build sensing systems based on CNT bundles, including the strain sensors demonstrated in this work.