Design and development of compact CDMA/WCDMA power amplifier module for high yield low cost manufacturing

Author

Xu, Sheldon ; Frey, Dick ; Chen, Tom ; Prejs, Art ; Anderson, Mike ; Miller, Jerry ; Arell, T. ; Singh, Mahendra ; Lertpiriyapong, Rattapon ; Parish, Alex ; Schrock, Rob ; Demarest, Eric ; Kini, Ajit ; Ryan, Jim

Author_Institution

Anadigics, Inc., Warren, NJ, USA

fYear

2004

fDate

24-27 Oct. 2004

Firstpage

49

Lastpage

52

Abstract

A low cost compact (3 mm × 3 mm) internally matched CDMA/WCDMA power amplifier module is designed with high-density-interconnection (HDI) laminate technology. Design methodologies for the power amplifier module are presented. Some advances in wafer processing technology are discussed. The PCS/IMT dual band WCDMA power amplifier achieves a typical 40% power-added-efficiency (PAE) at 27.5 dBm along with a -40 dBc linearity at 5 MHz offset frequency. At a low operating power of 16 dBm, 22% PAE can be achieved at V_cc = 1.5 V. Manufacturing yield issues are discussed as well.

Keywords

code division multiple access; integrated circuit interconnections; integrated circuit yield; low-power electronics; modules; power amplifiers; 1.5 V; 5 MHz; PCS-IMT dual band WCDMA power amplifier; compact CDMA-WCDMA power amplifier module; high yield manufacturing; high-density-interconnection laminate technology; internally matched CDMA-WCDMA power amplifier module; low cost manufacturing; manufacturing yield issues; wafer processing technology; Costs; Design methodology; Dual band; High power amplifiers; Laminates; Linearity; Manufacturing; Multiaccess communication; Personal communication networks; Power amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE

ISSN

1550-8781

Print_ISBN

0-7803-8616-7

Type

conf

DOI

10.1109/CSICS.2004.1392483

Filename

1392483