DocumentCode
2537517
Title
Sheet resistance and conductivity measurements of rough surfaces of metals on printed circuit boards and metalized ceramic substrates
Author
Krupka, Jerzy ; Usydus, L. ; Koltuniak, H.
Author_Institution
Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Warsaw, Poland
Volume
1
fYear
2012
fDate
21-23 May 2012
Firstpage
149
Lastpage
153
Abstract
In copper cladded laminates copper foil is roughened to promote adhesion of the dielectric resin. Sheet resistance of rough metal surfaces increases as a function of frequency, thus increasing signal attenuation. In this paper we present measurements of the sheet resistance of rough metal surfaces on several commercially available copper cladded laminates and on metalized ceramic substrates.
Keywords
adhesion; ceramics; copper; electric resistance measurement; electrical conductivity measurement; films; laminates; printed circuits; resins; rough surfaces; substrates; conductivity measurement; copper cladded laminate copper foil; dielectric resin adhesion; metal rough surface; metalized ceramic substrates; printed circuit boards; sheet resistance measurement; signal attenuation; conductivity; dielectric resonator; measurement; sheet resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Radar and Wireless Communications (MIKON), 2012 19th International Conference on
Conference_Location
Warsaw
Print_ISBN
978-1-4577-1435-1
Type
conf
DOI
10.1109/MIKON.2012.6233535
Filename
6233535
Link To Document