DocumentCode :
2538254
Title :
AlGaN-GaN HEMTs and HBTs for microwave power
Author :
Mishra, U.K. ; Ventury, R. ; McCarthy, L. ; Smorchkova, Y. ; Keller, S. ; Xing, H. ; Zhang, N. ; Speck, J.S. ; York, R. ; DenBaars, S. ; Wu, Y.-F. ; Parikh, P. ; Chavarkar, P.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fYear :
2000
fDate :
19-21 June 2000
Firstpage :
35
Lastpage :
36
Abstract :
Summary form only given. The AlGaN-GaN based material system offers the three most important materials properties required for efficient microwave power generation: very high breakdown electric field (/spl sim/2 MV/cm), high electron mobility and velocity (/spl mu//sub c//spl sim/1000 cm/sup 2//spl middot/V/sup -1/s/sup -1/ and v/sub s//spl sim/2/spl times/10/sup 7/ cm/spl middot/s/sup -1/ in bulk materials) and heterojunction technology to optimize device design. This has led to the rapid development of AlGaN-GaN HEMTs, grown heteroepitaxially on either sapphire or SiC substrates. AlGaN-GaN HBTs also show promise for power amplifier and switching applications. Inherent strengths of the HBT structure include high current densities and low phase noise, as well as improved linearity and threshold control. The progress in HEMT DC and RF performance has been spectacular and the possibility of insertion into high power systems is a distinct possibility. The HBTs continue to have to battle problems with p-type doping and associated processing difficulties. However, sustained progress in engineering around this problem holds promise for the future.
Keywords :
III-V semiconductors; aluminium compounds; electron mobility; gallium compounds; heterojunction bipolar transistors; microwave bipolar transistors; microwave field effect transistors; microwave power amplifiers; microwave switches; power HEMT; power bipolar transistors; semiconductor device breakdown; semiconductor device noise; Al/sub 2/O/sub 3/; AlGaN-GaN; AlGaN-GaN HBTs; AlGaN-GaN HEMTs; AlGaN-GaN based material system; HBT processing; HBT structure; HBTs; HEMT DC performance; HEMT RF performance; SiC; SiC substrates; breakdown electric field; current density; device design optimization; electron mobility; electron velocity; heteroepitaxial growth; heterojunction technology; linearity; materials properties; microwave power applications; microwave power generation; p-type doping; phase noise; power amplifier applications; power systems; sapphire substrates; switching applications; threshold control; Aluminum gallium nitride; Design optimization; Electric breakdown; Electron mobility; HEMTs; Heterojunctions; MODFETs; Material properties; Microwave technology; Power generation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2000. Conference Digest. 58th DRC
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-6472-4
Type :
conf
DOI :
10.1109/DRC.2000.877077
Filename :
877077
Link To Document :
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