• DocumentCode
    2538299
  • Title

    Preconditioning Matrix for Fast Hierarchical Method in 3-D Capacitance Extraction of IC interconnect

  • Author

    Wen, Ding ; Gaofeng, Wang

  • Author_Institution
    Wuhan Univ., Wuhan
  • fYear
    2007
  • fDate
    23-26 Oct. 2007
  • Firstpage
    532
  • Lastpage
    535
  • Abstract
    In 3-D capacitance extraction by indirect boundary element method (BEM), the dense potential coefficient matrix arising from the integral equation formulation is usually represented implicitly and concisely. This is a significant reduction compared to the O(n2) storage that would be required to store potential coefficient matrix directly. Further, the multiplication of matrix-vector product can be accomplished in time proportional to the size of the representation. However, the conventional preconditioning techniques for an explicit matrix are not applicable since no coefficient matrix is actually constructed. In this work, a preconditioning matrix for the fast hierarchical method (FHM) is proposed by carefully examining inherent properties of the hierarchical data structure in the FHM. This preconditioning matrix significantly enhances convergence of the iterative solution yet preserves the implicit nature of the matrix operations in the FHM. Numerical experiments included confirm: this preconditioned FHM reduces iteration times dramatically, and thereby the computational time is reduced.
  • Keywords
    boundary-elements methods; capacitance; integral equations; integrated circuit interconnections; matrix algebra; 3D capacitance extraction; IC interconnect; dense potential coefficient matrix; fast hierarchical method; indirect boundary element method; integral equation; preconditioning matrix; Acceleration; Capacitance; Convergence; Data mining; Data structures; Equations; Information retrieval; Iterative methods; Matrix decomposition; Sparse matrices; 3-D Capacitance Extraction; Fast Hierarchical Method; Preconditioning matrix;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2007. EMC 2007. International Symposium on
  • Conference_Location
    Qingdao
  • Print_ISBN
    978-1-4244-1371-3
  • Electronic_ISBN
    978-1-4244-1372-0
  • Type

    conf

  • DOI
    10.1109/ELMAGC.2007.4413548
  • Filename
    4413548