• DocumentCode
    2538389
  • Title

    SiGe low loss waveguides for 1.3 /spl mu/m grown by selective epitaxy

  • Author

    Vonsovici, A. ; Vescan, L. ; Pogossian, S.P.

  • Author_Institution
    Surrey Univ., Guildford, UK
  • fYear
    2000
  • fDate
    19-21 June 2000
  • Firstpage
    49
  • Lastpage
    50
  • Abstract
    The realisation of 2D SiGe-Si strained layer low loss waveguides (1.7 dB/cm) for the 1.3 /spl mu/m wavelength is reported. The waveguide geometry is grown by selective epitaxy. It ensures loose cut-off and critical thickness conditions. Recently, room-temperature operation of vertical emitting SiGe-Si LEDs made by selective epitaxy has been demonstrated and integration with SiGe-Si waveguides and photodetectors open the opportunity towards OEICs. The main design parameter for these devices is the confinement factor in the active SiGe layer. Recent advances in selective epitaxy allowed us to increase the Si/sub 1-x/Ge/sub x/ guiding film thickness by 4 times over the plastic relaxation limit on large areas. Therefore, higher confinement factors could be achieved. The main difference from other methods is the local deposition of the SiGe in a finite stripe region while in the conventional rib or ridge geometry, the SiGe layer is deposited on an entire wafer and then patterned by reactive ion etching. The increased amount of Ge (19%) incorporated in these waveguides, and a reduced Si cap layer are improvements from previous reported SiGe-Si waveguides, where thick Si cap layers and reduced Ge concentrations (<10%) are used.
  • Keywords
    Ge-Si alloys; elemental semiconductors; epitaxial growth; integrated optoelectronics; optical fabrication; optical losses; optical waveguides; semiconductor growth; semiconductor materials; silicon; 1.3 micrometre; 2D SiGe-Si strained layer low loss waveguides; Ge concentration; OEICs; Si/sub 1-x/Ge/sub x/ guiding film thickness; SiGe layer RIE patterning; SiGe low loss waveguides; SiGe-Si; SiGe-Si photodetectors; SiGe-Si waveguides; active SiGe layer confinement factor; critical thickness conditions; cut-off conditions; design parameter; finite stripe region; local deposition; plastic relaxation limit; reduced Si cap layer; rib geometry; ridge geometry; room-temperature operation; selective epitaxy; vertical emitting SiGe-Si LEDs; waveguide geometry; Detectors; Epitaxial growth; Germanium silicon alloys; Loss measurement; Optical buffering; Optical losses; Optical polarization; Optical waveguides; Propagation losses; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2000. Conference Digest. 58th DRC
  • Conference_Location
    Denver, CO, USA
  • Print_ISBN
    0-7803-6472-4
  • Type

    conf

  • DOI
    10.1109/DRC.2000.877083
  • Filename
    877083