DocumentCode :
2538400
Title :
Electrostatic torsional vertical flaps for reflective MEMS display
Author :
Jutzi, F. ; Noell, W. ; de Rooij, N.F.
Author_Institution :
Sensors, Actuators & Microsyst. Lab. (SAMLAB), Ecole Polytech. Fed. de Lausanne (EPFL), Neuchâtel, Switzerland
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
2924
Lastpage :
2927
Abstract :
A new kind of high contrast, MEMS-based reflective display system is being developed. The system consists of light reflective flaps on an optically absorptive surface. The novelty is that the flaps are in vertical position at their rest state. They can be electrostatically turned to horizontal state. A trench refilling technique on a silicon-on-insulator (SOI) wafer is used to fabricate the torsional polysilicon flaps. Low voltage and low power is required for actuation. With the same process also novel shutter and flap structures can be fabricated.
Keywords :
display instrumentation; microfabrication; micromechanical devices; silicon-on-insulator; SOI wafer; Si; electrostatic torsional vertical flap; optically absorptive surface; poly torsional trench refilling technique; reflective MEMS display system; silicon-on-insulator wafer; Electrodes; Electrostatics; Fabrication; Materials; Optical reflection; Pixel; Surface treatment; electrostatic actuation; low voltage; micromirror; reflective display; shutter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969717
Filename :
5969717
Link To Document :
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