DocumentCode :
2538752
Title :
Passive components using quasi-CPW in eWLB package
Author :
PourMousavi, M. ; Wojnowski, M. ; Pressel, K. ; Sommer, G. ; Weigel, Robert
Author_Institution :
University of Erlangen-Nuremberg, Cauerstr. 9, 91058 Erlangen, Germany
Volume :
2
fYear :
2012
fDate :
21-23 May 2012
Firstpage :
709
Lastpage :
712
Abstract :
This paper presents design and simulation of high frequency passive components integrated in the thin-film redistribution layer (RDL) of an embedded wafer level ball grid array (eWLB). The eWLB is an innovative package solution for high frequency and high performance applications. In this work, we investigate the integration of passive components such as antennas, transmission lines and couplers in an eWLB package at the ISM (Industrial, Scientific and Medical) frequency band (61–61.5 GHz). We present simulation results for a new quasi-CPW (coplanar waveguide). This line consists of an elevated center conductor above the ground planes on its both sides and offers a considerably wider range of feasible characteristic impedances compared to classical CPW. The achieved impedances are between 14 Ω and 110 Ω. The obvious advantage of using the new quasi-CPW is simple realization of ground connection. We introduce a rat race coupler designed at 61 GHz using the new quasi-CPW. Finally, we demonstrate the feasibility of an antenna concept in the ISM band. We design a single-ended patch antenna using a new quasi-CPW. The simulated directivity of the antenna is 9dBi.
Keywords :
Coplanar waveguides; Couplers; Electronics packaging; Impedance; Patch antennas; Simulation; antenna in package; eWLB package; integrated antenna; millimeter wave integrated circuits; packaging technology; system-in-package;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Radar and Wireless Communications (MIKON), 2012 19th International Conference on
Conference_Location :
Warsaw, Poland
Print_ISBN :
978-1-4577-1435-1
Type :
conf
DOI :
10.1109/MIKON.2012.6233595
Filename :
6233595
Link To Document :
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