• DocumentCode
    2538911
  • Title

    “Bottom-up” three-dimensional metamaterials at terahertz frequencies

  • Author

    Fan, Kebin ; Strikwerda, Andrew C. ; Averitt, Richard D. ; Zhang, Xin

  • Author_Institution
    Boston Univ., Boston, MA, USA
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    2662
  • Lastpage
    2665
  • Abstract
    In this paper, we present our recent progress on three-dimensional (3D) metamaterials at terahertz (THz) frequencies. Using a “bottom-up” multilayer electroplating technique, a flexible and a broadband tunable metamaterial was fabricated and characterized. In agreement well with numerical simulations, characterization on these 3D metamaterials by THz time domain spectroscopy (THz-TDS) indicates excellent performance of 3D metamaterials in manipulating electromagnetic waves. The successful fabrication of these 3D structures from well-defined building blocks provides a new pathway towards “bottom-up” 3D metamaterials for potential applications at THz frequencies.
  • Keywords
    metamaterials; numerical analysis; terahertz spectroscopy; 3D metamaterials; 3D structure fabrication; THz-TDS; bottom-up multilayer electroplating technique; bottom-up three-dimensional metamaterials; broadband tunable metamaterial; electromagnetic waves; numerical simulations; terahertz frequency; terahertz time domain spectroscopy; well-defined building blocks; Fabrication; Magnetic materials; Metamaterials; Resists; Silicon; Substrates; Three dimensional displays; 3D structures; Metamaterials; Multilayer electroplating; Terahertz;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969740
  • Filename
    5969740