Title :
Packaging technologies for optoelectronics in the new millennium
Author :
Janssen, Adrian P.
Author_Institution :
Nortel UK, UK
Abstract :
Performance and cost demands on future optoelectronic components are likely to continue in the foreseeable future as fibre networks are increasingly deployed. To meet these demands, new materials and manufacturing methods need to evolve from components which are designed to be fully hermetic to meet the system reliability requirements or which require precision manual optical alignment as part of the manufacturing process. The advent of WDM systems and optical switching will also require packaging of multi-fibre (ribboned) components.
Keywords :
integrated circuit packaging; integrated optoelectronics; optical communication equipment; optical fibre fabrication; optical fibre networks; packaging; telecommunication network reliability; wavelength division multiplexing; WDM systems; fibre networks; fully hermetic; manufacturing methods; manufacturing process; multi-fibre ribboned components; optical fibre fabrication; optical fibre networks; optical switching; optoelectronics; packaging technologies; precision manual optical alignment; system reliability requirements; Costs; Encapsulation; Fiber lasers; Optical devices; Optical network units; Optical polymers; Optical receivers; Packaging; Power lasers; Silicon;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-3160-5
DOI :
10.1109/LEOS.1996.571540
