DocumentCode :
2539072
Title :
Wafer-level hermetic vacuum micro-packaging technology for IR detector applications
Author :
García-Blanco, S. ; LeFoulgoc, K. ; Desroches, Y. ; Caron, J.S. ; Topart, P. ; Alain, C. ; Jerominek, H.
Author_Institution :
INO, Quebec City, QC, Canada
fYear :
2009
fDate :
4-8 Oct. 2009
Firstpage :
57
Lastpage :
58
Abstract :
A low-cost low temperature wafer-level vacuum micropackage has been developed exhibiting an equivalent flow rate of 3.8times10-14 Torr.L/sec for storage at 80degC.
Keywords :
bolometers; cryogenic electronics; infrared detectors; micro-optomechanical devices; vacuum techniques; wafer level packaging; IR detector; MEMS; hermetic vacuum micropackaging technology; infrared detector; low temperature packaging; microbolometer; temperature 80 C; wafer-level packaging; Assembly; Costs; Infrared detectors; Micromechanical devices; Packaging; Space technology; Submillimeter wave technology; Temperature; Vacuum technology; Wafer scale integration; MEMS; hermetic; microbolometer; micropackaging; vacuum; wafer-level packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
Conference_Location :
Belek-Antalya
ISSN :
1092-8081
Print_ISBN :
978-1-4244-3680-4
Electronic_ISBN :
1092-8081
Type :
conf
DOI :
10.1109/LEOS.2009.5343470
Filename :
5343470
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2539072
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