DocumentCode
2539127
Title
Surface activation based nanobonding technologies for optoelectronics packaging
Author
Howlader, M.M.R.
Author_Institution
Electr. & Comput. Eng. Dept., McMaster Univ., Hamilton, ON, Canada
fYear
2009
fDate
4-8 Oct. 2009
Firstpage
55
Lastpage
56
Abstract
This article discusses the potential of surface activation based nanobonding technologies. Three-strategies of the nanobonding technologies with a number of applications such as the bonding of copper nanobumps, III-V materials and ionic materials have been discussed.
Keywords
bonding processes; copper; electronics packaging; integrated optoelectronics; interconnections; nanoelectronics; surface treatment; copper nanobumps bonding; high density interconnection; ionic material bonding; nanobonding technologies; optoelectronics packaging; surface activation; Packaging; Surface activation; interconnection; nanobonding; optoelectronics; packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE
Conference_Location
Belek-Antalya
ISSN
1092-8081
Print_ISBN
978-1-4244-3680-4
Electronic_ISBN
1092-8081
Type
conf
DOI
10.1109/LEOS.2009.5343473
Filename
5343473
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