DocumentCode
2539366
Title
A new prediction-methodology on avionics embedded electronics: why? how?
Author
Charpenel, P. ; Cavernes, P. ; Casanovas, V.
Author_Institution
Tech. Dept., GIAT Ind., Toulouse, France
fYear
1999
fDate
18 -21 Jan 1999
Firstpage
378
Lastpage
382
Abstract
Systematic embedded equipment follow-up shows a great difference between reliability prediction and the field reliability. The authors study another reliability prediction method, based on the reliability tests performed by the parts manufacturers. The proposed methodology is applied to avionics embedded electronics equipment and the results are compared to field return data. A very good accordance between these predictive reliability data and field data is shown. The limitations of this methodology are also analyzed
Keywords
aerospace simulation; avionics; circuit reliability; failure analysis; avionics embedded electronics equipment; field return data; predictive reliability data; reliability; reliability prediction methodology; Aerospace electronics; Electronic equipment; Electronic equipment manufacture; Electronic equipment testing; Embedded computing; Failure analysis; Performance evaluation; Prediction methods; Pulp manufacturing; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 1999. Proceedings. Annual
Conference_Location
Washington, DC
Print_ISBN
0-7803-5143-6
Type
conf
DOI
10.1109/RAMS.1999.744147
Filename
744147
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