Title :
A new prediction-methodology on avionics embedded electronics: why? how?
Author :
Charpenel, P. ; Cavernes, P. ; Casanovas, V.
Author_Institution :
Tech. Dept., GIAT Ind., Toulouse, France
Abstract :
Systematic embedded equipment follow-up shows a great difference between reliability prediction and the field reliability. The authors study another reliability prediction method, based on the reliability tests performed by the parts manufacturers. The proposed methodology is applied to avionics embedded electronics equipment and the results are compared to field return data. A very good accordance between these predictive reliability data and field data is shown. The limitations of this methodology are also analyzed
Keywords :
aerospace simulation; avionics; circuit reliability; failure analysis; avionics embedded electronics equipment; field return data; predictive reliability data; reliability; reliability prediction methodology; Aerospace electronics; Electronic equipment; Electronic equipment manufacture; Electronic equipment testing; Embedded computing; Failure analysis; Performance evaluation; Prediction methods; Pulp manufacturing; Temperature;
Conference_Titel :
Reliability and Maintainability Symposium, 1999. Proceedings. Annual
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5143-6
DOI :
10.1109/RAMS.1999.744147
