• DocumentCode
    2539482
  • Title

    Solutions to the fabrication problems of hybrid optoelectronic VLSI CMOS chips

  • Author

    D´Asaro, L.A.

  • Author_Institution
    Bell Labs., Lucent Technol., Murray Hill, NJ, USA
  • Volume
    2
  • fYear
    1996
  • fDate
    18-21 Nov. 1996
  • Firstpage
    48
  • Abstract
    Summary form only given. In the present work, done with numerous collaborators at Bell Laboratories, we describe solutions to the fabrication problems in scaling up the hybrid CMOS technology to VLSI. The application to a high speed ATM switching fabric required 8704 micro solder bonds.
  • Keywords
    CMOS integrated circuits; VLSI; integrated circuit technology; integrated optoelectronics; optical fabrication; soldering; Bell Laboratories; VLSI; high speed ATM switching fabric; hybrid CMOS technology; hybrid optoelectronic VLSI CMOS chip fabrication; micro solder bonds; Bonding; Diodes; Etching; Gallium arsenide; Optical device fabrication; Optical modulation; Photodetectors; Quantum well devices; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-3160-5
  • Type

    conf

  • DOI
    10.1109/LEOS.1996.571542
  • Filename
    571542
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2539482