• DocumentCode
    253966
  • Title

    3D-Aided Face Recognition Robust to Expression and Pose Variations

  • Author

    Chu, Baptiste ; Romdhani, Sami ; Liming Chen

  • Author_Institution
    SAFRAN Group, Morpho, Issy-Les-Moulineaux, France
  • fYear
    2014
  • fDate
    23-28 June 2014
  • Firstpage
    1907
  • Lastpage
    1914
  • Abstract
    Expression and pose variations are major challenges for reliable face recognition (FR) in 2D. In this paper, we aim to endow state of the art face recognition SDKs with robustness to facial expression variations and pose changes by using an extended 3D Morphable Model (3DMM) which isolates identity variations from those due to facial expressions. Specifically, given a probe with expression, a novel view of the face is generated where the pose is rectified and the expression neutralized. We present two methods of expression neutralization. The first one uses prior knowledge to infer the neutral expression image from an input image. The second method, specifically designed for verification, is based on the transfer of the gallery face expression to the probe. Experiments using rectified and neutralized view with a standard commercial FR SDK on two 2D face databases, namely Multi-PIE and AR, show significant performance improvement of the commercial SDK to deal with expression and pose variations and demonstrates the effectiveness of the proposed approach.
  • Keywords
    face recognition; image morphing; pose estimation; solid modelling; 2D face databases; 3D-aided face recognition; 3DMM; AR database; expression neutralization; extended 3D morphable model; facial expression variation; gallery face expression; multiPIE database; neutral expression image; pose variation; standard commercial FR SDK; Databases; Face; Face recognition; Probes; Shape; Solid modeling; Three-dimensional displays; 3D Morphable Model; Expression; Face Recognition; Face modelling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Vision and Pattern Recognition (CVPR), 2014 IEEE Conference on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/CVPR.2014.245
  • Filename
    6909642