DocumentCode
2539716
Title
Growth of horizontally aligned carbon nanotubes from designated sidewalls of DRIE-etched silicon trench
Author
Lu, Jingyu ; Miao, Jianmin ; Xu, Ting
Author_Institution
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2011
fDate
5-9 June 2011
Firstpage
637
Lastpage
640
Abstract
Horizontally aligned carbon nanotubes (HACNTs) were grown from designated trench sidewalls in silicon substrate with chemical vapor deposition (CVD) system. The silicon trenches were fabricated with microelectromechanical system (MEMS) technology, and Fe catalysts were deposited onto the selected trench sidewalls by tilt angle electron beam evaporation. Characterizations of the as-grown CNTs were performed with scanning electron microscopy (SEM), transmission electron microscopy (TEM), Raman spectroscopy and current-voltage measurement. The good horizontal alignment is mainly attributed to the van der Waals interaction within these dense CNTs. The growth of HACNTs, together with their good electrical performance will inspire further efforts towards their application in micro/nanoelectronics.
Keywords
Raman spectra; carbon nanotubes; catalysts; chemical vapour deposition; iron; microfabrication; micromechanical devices; nanofabrication; scanning electron microscopy; sputter etching; transmission electron microscopy; van der Waals forces; DRIE etched silicon trench; Fe catalysts; HACNT; Raman spectroscopy; chemical vapor deposition; current-voltage measurement; deep reactive ion etching; fabrication; horizontally aligned carbon nanotubes; microelectromechanical system; microelectronics; nanoelectronics; sidewalls; silicon substrate; tilt angle electron beam evaporation. scanning electron microscopy; transmission electron microscopy; van der Waals interaction; Carbon nanotubes; Iron; Nanoelectronics; Physics; Resists; Silicon; Substrates; carbon nanotubes; horizontal; sidewall; trench;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location
Beijing
ISSN
Pending
Print_ISBN
978-1-4577-0157-3
Type
conf
DOI
10.1109/TRANSDUCERS.2011.5969787
Filename
5969787
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