DocumentCode :
2539768
Title :
Vertical silicon nano-pillar for non-volatile memory
Author :
Leong, V.X.H. ; Ng, E.J. ; Soon, J.B.W. ; Singh, N. ; Shen, N. ; Myint, T. ; Pott, V. ; Tsai, J.M.
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
649
Lastpage :
652
Abstract :
NanoElectroMechanical (NEM) switches have been proposed for non-volatile memory applications, but low device density remains a key challenge for horizontal switches. This paper presents a resistive, vertically oriented NanoElectroMechanical (NEM) nano-pillar cantilever switch made of mono-crystaline silicon, with a cell size of 8F2. Using a top-down CMOS-compatible process requiring two lithography masks, nano-pillar switches with a height of 500nm, tip thickness of 35nm, and 25nm air gap are fabricated. Device switching is performed using electrostatic actuation, while non-volatile memory function is achieved by maintaining switch contact with van der Waals forces after pull-in even when the actuating voltage is removed. Switching and non-volatile memory capabilities are demonstrated, with pull-in voltage Vpi = 17V and release voltage Vrelease = -25V. With low-cost fabrication process and high device density, the nano-pillar device is a promising candidate for non-volatile memory applications.
Keywords :
CMOS memory circuits; electrostatic actuators; nanoelectromechanical devices; random-access storage; silicon; NEM nanopillar cantilever switch; Si; electrostatic actuation; horizontal switches; lithography masks; nanoelectromechanical nanopillar cantilever switch; nonvolatile memory; size 25 nm; size 35 nm; size 500 nm; top-down CMOS-compatible process; van der Waals forces; voltage -25 V; voltage 17 V; Robustness; Switches; CMOS; Nanoelectromechanical systems (NEMS); nano-pillar; non-volatile memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969790
Filename :
5969790
Link To Document :
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