Technology for the future marketplace: a perspective on Ka and on-board processing technology

Modular product line satellites are now the norm for high-power transponder satellite markets. Advances in multi-beam Ka components and on-board processing have been stimulated by NASA studies and MILSATCOM developments, These advanced payload technologies are still, however, in development. The challenge then is to coordinate the simultaneous evolution of advanced payload technology development and advanced high-power modular product line satellites. This paper explores the state of advanced payload technologies and postulates product line partitions that may lend themselves to modular cost-effective integration of advanced payload technologies into the next generation satellites. Modular cost-effective integration and suppliers will be necessary if the cost of mature advanced multi-beam Ka-band and on-board processing satellites is to approach the commodity pricing environment driving current high-power transponder satellites. These partitions may also indicate a focus for the multiple worldwide study and development activities