Three dimensional nanoscale fabrication and modeling of dynamic mode multidirectional UV lithography

Three dimensional (3-D) nanofabrication using the dynamic mode multidirectional ultraviolet (UV) lithography has been explored, where the size of the photomask pattern is compatible to or smaller than the wavelength of the UV source and therefore the diffraction effect is prominent in photopatterning. Ray trace taking into account the effect of refraction, diffraction, and absorption has been simulated using an optical numerical analysis tool (COMSOL, Inc.). Subwavelength patterning with a pattern diameter of 300nm has been performed on a chromium coated glass substrate using E-beam lithography to form a photomask. A thin layer of SU-8, a negative tone photoresist, with a thickness of 1~10 microns has been coated on the photomask and multidirectional UV lithography is performed through the mask, where the photomask servs as a substrate as well. Nanoscale pillars with a pattern diameter of 300nm have been fabricated with different optical doses and simulation results show good correlation with simulation results in terms of the shape and the height. Various 3-D structures including an inclined pillar array, a vertical triangular slab, a tripod embedded horn, and a triangular slab embedded horn have been successfully fabricated. A vertical triangular slab array has been demonstrated for a terahertz (THz) selective surface application.