Title :
Package Alternatives for Integrated Power Electronic Modules (IPEM) with Improved Voltage Rating
Author :
Xu, Jing ; van Wyk, J.D. ; Ngo, Khai
Author_Institution :
Center for Power Electronics System (CPES), Virginia Polytechnic Institite and State University, Blacksburg, VA 24060, USA
fDate :
Feb. 25 2007-March 1 2007
Abstract :
The electric field in a baseline Integrated Power Electronic Module (IPEM) as a function of different parameters is evaluated. The electric field distribution inside the embedded insulation material in the IPEM is studied, and several improved structures are discussed. Simulation results suggest that the peak electric field intensity in the embedded insulation material can be reduced by 40%. The blocking capability of the improved structures is not degraded by voids inside the embedded insulation material. The experimental results agree with the simulation results.
Keywords :
Degradation; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electronics packaging; Integrated circuit interconnections; Metallization; Power electronics; Silicon; Voltage;
Conference_Titel :
Applied Power Electronics Conference, APEC 2007 - Twenty Second Annual IEEE
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-4244-0713-3
DOI :
10.1109/APEX.2007.357547
