Title :
A CMOS Low-Power Cross-Coupled Immittance-Converter Transimpedance Amplifier
Author :
Taghavi, M.H. ; Belostotski, L. ; Haslett, J.W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Calgary, Calgary, AB, Canada
Abstract :
This letter presents a low-power transimpedance amplifier (TIA) that employs an immittance converter, which provides both a negative input resistance to increase the input pole frequency and a negative inductance to improve the circuit stability. These allow for a significant bandwidth enhancement with low power consumption. Two TIAs, TIA1 with 6 GHz and TIA2 with 8.8 GHz 3 dB bandwidths, were fabricated in a standard 0.13- μm CMOS technology and were designed to operate with a 250 fF photodiode capacitance at 10 Gb/s. The transimpedance gains of the single-stage TIAs, followed by near-unity-gain output-matching buffers, are ~ 54 dBΩ, the group-delay variations and average input-referred noise currents are ±3 ps and 24 pA/√{Hz} (TIA1) and ±70 ps and 28 pA/√{Hz} (TIA2) over their 3 dB bandwidths. The TIAs occupy an active area of 250 μm× 160 μm, and without the output-matching buffer each consumes 2 mW.
Keywords :
CMOS analogue integrated circuits; MMIC amplifiers; circuit stability; convertors; integrated circuit design; integrated circuit noise; operational amplifiers; photodiodes; CMOS low-power cross-coupled immittance-converter transimpedance amplifier; average input-referred noise current; bandwidth 8.8 GHz; bit rate 10 Gbit/s; capacitance 250 fF; circuit stability; frequency 6 GHz; gain 3 dB; group-delay variation; input pole frequency; near-unity-gain output-matching buffer; negative inductance; negative input resistance; output-matching buffer; photodiode capacitance; power 2 mW; power consumption; single-stage TIA; size 0.13 mum; Bandwidth; CMOS integrated circuits; Capacitance; Current measurement; Gain; Noise; Transfer functions; CMOS optical receiver; cross-coupled pair; immittance-converter; transimpedance amplifier (TIA);
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2015.2421253