• DocumentCode
    2540873
  • Title

    Power enhancement of micro thermoelectric generators by micro fluidic heat transfer packaging

  • Author

    Wojtas, N.Z. ; Schwyter, E. ; Glatz, W. ; Kühne, S. ; Escher, W. ; Hierold, C.

  • Author_Institution
    Micro & Nanosystems, ETH Zurich, Zurich, Switzerland
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    731
  • Lastpage
    734
  • Abstract
    This paper reports the design, fabrication and proof of concept of a multilayer fluidic packaging system enabling an increase in the output power performance of micro thermoelectric generators (μTEGs). The complete integration of the fluidic heat transfer system (HTS) with a μTEG is successfully demonstrated. The fabricated μHTS prototypes were tested with respect to their heat transfer resistance and consumed pumping power. A heat transfer resistance of 0.48cm2K/W was achieved with a small pumping power of 3.7mW/cm2. This results in a potential μTEG power output enhancement of 38 times at a heat source temperature of 320K, cold side temperature of 300K and a thermoelectric figure of merit (Z) of 1.1×10-3 K-1.
  • Keywords
    heat transfer; microfluidics; packaging; thermoelectric conversion; micro fluidic heat transfer packaging; micro thermoelectric generators; multilayer fluidic packaging system; power enhancement; Copper; Heat sinks; Heat transfer; High temperature superconductors; Manifolds; Resistance; Resistance heating; Thermoelectric power generation; heat transfer resistance; micro fluidic packaging; micro heat transfer systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969853
  • Filename
    5969853