DocumentCode :
2540945
Title :
Thinned-PZT on SOI process and design optimization for piezoelectric inertial energy harvesting
Author :
Aktakka, Ethem Erkan ; Peterson, Rebecca L. ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated Microsyst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
1649
Lastpage :
1652
Abstract :
This paper presents the design, fabrication, and testing of a thinned-PZT/Si unimorph for vibration energy harvesting. It produces a record power output and has state-of-the-art efficiency. The harvester utilizes thinning of bulk-PZT pieces bonded to an SOI wafer, and takes advantage of the similar thermal expansion between PZT and Si to minimize beam bending due to residual stress. Monolithic integration of a tungsten proof mass lowers the resonance frequency and increases the power output. The harvester dimensions, including the PZT/Si thickness ratio and the proof-mass/total-beam length ratio, are optimized via parametric multi-physics FEA. Additionally, a fabrication process for hermetic packaging of the harvester is introduced. It uses vertical Si vias for electrical feed-throughs. An unpackaged harvester with a tungsten proof mass produces 2.74 μW at 0.1 g (167 Hz), and 205 μW at 1.5 g (154 Hz) at resonance (here, g = 9.8 m/s2). The active device volume is 27 mm3 (7 × 7 × 0.55 mm3). We report the highest power output, Normalized Power Density (N.P.D.), and Figure of Merit (N.P.D. × Bandwidth) amongst reported microfabricated vibration energy harvesters.
Keywords :
energy harvesting; packaging; piezoelectric devices; thermal expansion; SOI process; frequency 154 Hz; frequency 167 Hz; hermetic packaging; mass 0.1 g; mass 1.5 g; monolithic integration; piezoelectric inertial energy harvesting; power 2.74 muW; power 205 muW; thermal expansion; thinned-PZT; vibration energy harvesting; Bandwidth; Bonding; Energy harvesting; Resonant frequency; Silicon; Vibrations; Harvesting; PZT; bonding; energy; inertial; piezoelectric; power generation; scavenging; thinning; vibration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
ISSN :
Pending
Print_ISBN :
978-1-4577-0157-3
Type :
conf
DOI :
10.1109/TRANSDUCERS.2011.5969857
Filename :
5969857
Link To Document :
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