Title :
Programmable self-assembly for microsystem integration
Author :
Hoo, J.H. ; Park, K.S. ; Baskaran, R. ; Böhringer, K.F.
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Abstract :
We present microscale self-assembly as a suite of techniques that promotes the electronics industry´s initiative towards functional diversification and function densification, and two specific programmable self-assembly projects that are driven by real-world limitations and aspirations of present assembly and packaging technologies. Towards said goals, we demonstrate that our processes can improve existing assembly and packaging techniques, and also enable possibilities restricted by current industry methodologies.
Keywords :
electronics industry; electronics packaging; micromechanical devices; self-assembly; electronics industrys; function densification; functional diversification; microsystem integration; packaging techniques; programmable self-assembly; Assembly; Legged locomotion; Packaging; Self-assembly; Silicon; Substrates; Surface treatment; Self-assembly; assembly; heterogeneous integration; packaging;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0157-3
DOI :
10.1109/TRANSDUCERS.2011.5969886
