• DocumentCode
    2541826
  • Title

    Chances of supply current test techniques for mixed signal integrated circuits

  • Author

    Argüelles, J. ; López, M.J.

  • Author_Institution
    Microelectron. Eng. Group, Cantabria Univ., Santander, Spain
  • fYear
    1998
  • fDate
    36043
  • Firstpage
    42491
  • Lastpage
    42495
  • Abstract
    Simulation results lead to the conclusion that from the different measurements that can be carried out upon the Idd: the quiescent current level, the transient peak amplitude, width and position; those affecting the absolute current level measurement, (quiescent current and transient peak amplitude), exhibit larger dependence upon process variations than those based on temporal measurements, (transient peak width and position). Fault simulation indicates comparable effectiveness for Iddq and Tpw measurements. Tpw measurement seems to be more sensible to fault effect than Iddq measurement, since 100 % of faults produce a 20 % variation in Tpw, when compared to a fault free reference, versus the 55 % of faults that produce such variation in Iddq
  • Keywords
    integrated circuit testing; absolute current level measurement; fault effect; mixed signal integrated circuits; process variations; quiescent current level; supply current test techniques; transient peak amplitude; transient peak position; transient peak width;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Systems on a Chip (Ref. No. 1998/439), IEE Colloquium on
  • Conference_Location
    Dublin
  • Type

    conf

  • DOI
    10.1049/ic:19980659
  • Filename
    744463