Title :
Chances of supply current test techniques for mixed signal integrated circuits
Author :
Argüelles, J. ; López, M.J.
Author_Institution :
Microelectron. Eng. Group, Cantabria Univ., Santander, Spain
Abstract :
Simulation results lead to the conclusion that from the different measurements that can be carried out upon the Idd: the quiescent current level, the transient peak amplitude, width and position; those affecting the absolute current level measurement, (quiescent current and transient peak amplitude), exhibit larger dependence upon process variations than those based on temporal measurements, (transient peak width and position). Fault simulation indicates comparable effectiveness for Iddq and Tpw measurements. Tpw measurement seems to be more sensible to fault effect than Iddq measurement, since 100 % of faults produce a 20 % variation in Tpw, when compared to a fault free reference, versus the 55 % of faults that produce such variation in Iddq
Keywords :
integrated circuit testing; absolute current level measurement; fault effect; mixed signal integrated circuits; process variations; quiescent current level; supply current test techniques; transient peak amplitude; transient peak position; transient peak width;
Conference_Titel :
Systems on a Chip (Ref. No. 1998/439), IEE Colloquium on
Conference_Location :
Dublin
DOI :
10.1049/ic:19980659