• DocumentCode
    2542585
  • Title

    AFFCCA: a tool for critical area analysis with circular defects and lithography deformed layout

  • Author

    Bubel, Igor ; Maly, Wojciech ; Waas, Thomas ; Nag, Pranab K. ; Hartmann, Hans ; Schmitt-Landsiedel, Doris ; Griep, Susanne

  • Author_Institution
    Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
  • fYear
    1995
  • fDate
    13-15 Nov 1995
  • Firstpage
    10
  • Lastpage
    18
  • Abstract
    This paper describes the AFFCCA (Accurate, Fast, Flexible Computation of Critical Area) tool. The algorithms implemented in AFFCCA can handle arbitrary geometry, defects causing shorts of arbitrary shapes, and a spectrum of process induced layout deformations. The presented results indicate that the unique features of AFFCCA allow for significant improvements in the accuracy of critical area computations
  • Keywords
    circuit layout CAD; integrated circuit layout; lithography; AFFCCA; IC critical area computations; circular defects; critical area analysis tool; lithography deformed layout; process induced layout deformations; Conducting materials; Costs; Geometry; Integrated circuit layout; Lithography; Manufacturing; Research and development; Shape; Solid state circuits; Yield estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 1995. Proceedings., 1995 IEEE International Workshop on,
  • Conference_Location
    Lafayette, LA
  • ISSN
    1550-5774
  • Print_ISBN
    0-8186-7107-6
  • Type

    conf

  • DOI
    10.1109/DFTVS.1995.476932
  • Filename
    476932
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2542585