• DocumentCode
    2543692
  • Title

    Computer simulation for the pile soil interaction under different head loads

  • Author

    Lu, Dun-hua ; He, Zhong-Ming

  • Author_Institution
    Dept. of Environ. Eng., Henan Inst. of Technol., Zhenzhou, China
  • fYear
    2010
  • fDate
    16-18 April 2010
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    Piles are widely used in civil engineering, there exist many analysis method to study the stress and displacement of pile and soil, but due to the complicated interaction between them, the insitu test and analytical analysis show some limitation. So it is necessary to find some other methods to solve this problem. Due to the rapid advances in computer technology and sustained development, numerical modeling and simulation shows powerful tools. In order to numerical simulate the pile soil interaction to study the mechanical deformation characteristic of soil and pile, the numerical software FLAC3D is used to simulate the procedure of pile being loaded in the soil. After calculation, the mechanical characteristic of pile, response of soil are analyzed, the corresponding skin friction stress and axial stress distribution of pile are obtained, as well as the vertical displacement of soil, whose result can give some guidance for the further study.
  • Keywords
    civil engineering computing; deformation; digital simulation; foundations; friction; numerical analysis; soil; stress analysis; FLAC3D; axial stress distribution; civil engineering; computer simulation; head loads; mechanical deformation characteristic; numerical modeling; pile soil interaction; skin friction stress; Civil engineering; Computational modeling; Computer simulation; Deformable models; Numerical models; Numerical simulation; Skin; Soil; Stress; Testing; Numerical modeling; computer simulation; interaction; pile; soil;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Management and Engineering (ICIME), 2010 The 2nd IEEE International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5263-7
  • Electronic_ISBN
    978-1-4244-5265-1
  • Type

    conf

  • DOI
    10.1109/ICIME.2010.5477612
  • Filename
    5477612