Title :
Volume production of unique plastic surface-mount modules for the IBM 80-ns 1-Mbit DRAM chip by area wire bond techniques
Author :
Ward, William C.
Author_Institution :
IBM Gen. Technol. Div., Essex Junction, VT, USA
Abstract :
The implementation of a 26-lead small-outline J-lead (SOJ) integrated-circuit surface-solder plastic package is described. A plastic SOJ package for this chip design which, by conventional wire bond methods, is neither feasible nor manufacturable is used. The packaging method, developed in parallel with device design, takes advantage of unconventional chip input/output (I/O) pad placement to produce an internal package construction called area-wire-bond (A-wire) which complements mechanical, thermal, and electrical device performance functions. Data gathered during the qualification of the manufacturing lines have shown that A-wire packages consistently exceed established IBM reliability criteria for semiconductor packages
Keywords :
integrated memory circuits; lead bonding; modules; random-access storage; surface mount technology; 1 Mbit; 80 ns; A-wire packages; IBM DRAM chip; IBM reliability criteria; area wire bond techniques; chip input/output pad placement; integrated-circuit; packaging method; plastic SOJ package; plastic surface-mount modules; semiconductor packages; small-outline J-lead IC surface solder plastic package; volume production; Bonding; Chip scale packaging; Manufacturing; Plastic packaging; Production; Qualifications; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device reliability; Wire;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12647
