Progress in large-area CuInSe2 thin film modules

Prototype modules of CuInSe₂ (CIS) have been fabricated with efficiencies that exceed 10%. The challenge is to improve the processing yield of these modules to that suitable to advance to pilot manufacturing. A number of analytical tools have been developed to provide insight into the loss mechanisms in these large-area monolithic structures. Techniques for characterizing the adhesion of the semiconductors, the device quality, the interconnect quality, and the film uniformity are discussed. Improvements in adhesion have eliminated the primary cause of mechanical failure, leading to tighter module efficiency distributions