DocumentCode
2544119
Title
Solving packaging issues for low-cost Si integrated optical components
Author
Harpin, Mr Arnold P R
Author_Institution
Bookham Technol. Ltd., Rutherford Appleton Lab., Chilton, UK
Volume
2
fYear
1996
fDate
18-21 Nov. 1996
Firstpage
105
Abstract
Silicon is a viable optical material and it is anticipated that its impact will be as great as its impact in the electronics field. This is because ofthe ability to micromachine and cheaply package integrated optical components made with silicon. This potentially opens up whole new vistas to integrated optics such as fibres to the home.
Keywords
integrated circuit packaging; integrated optics; micromachining; optical communication equipment; optical fibre subscriber loops; silicon; Si; cheaply package; electronics field; fibres to the home; integrated optical components; low-cost Si integrated optical components; micromachine; optical material; packaging issues; Fiber lasers; Optical devices; Optical fiber devices; Optical interferometry; Optical refraction; Optical variables control; Optical waveguides; Packaging; Silicon; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-3160-5
Type
conf
DOI
10.1109/LEOS.1996.571572
Filename
571572
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