DocumentCode :
254500
Title :
Transducer driver with active bootstrap switch
Author :
Jun Yu ; Arasu, M.A.
Author_Institution :
Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
fYear :
2014
fDate :
10-12 Dec. 2014
Firstpage :
484
Lastpage :
487
Abstract :
This paper presents a high-voltage driver with both upper-side and lower-side power transistors, which is used to drive a piezoelectric transducer. An active bootstrap switch circuit has been proposed to replace the diode required in a conventional bootstrap circuit. This work is primarily driven by the lack of diodes for high-temperature operation. Besides that, the proposed design has the advantages of smaller in size, robust thermal stability, and low forward voltage drop, compared to the bootstrap diode approach. In addition, the active bootstrap switch circuit mitigates the capacitor over-charge issue due to the negative transient voltage at the output of the driver. The design is fabricated using 1.0-μm SOI CMOS process, and the reverse leakage current of the active bootstrap switch is measured up to 300 °C, beyond the specified process limit of 225 °C.
Keywords :
CMOS integrated circuits; bootstrap circuits; circuit stability; driver circuits; high-temperature electronics; integrated circuit design; piezoelectric transducers; power transistors; semiconductor switches; silicon-on-insulator; thermal stability; transistor circuits; SOI CMOS process; active bootstrap switch circuit; bootstrap diode approach; capacitor over-charge mitigation; high-temperature operation; high-voltage driver; low forward voltage drop; lower-side power transistors; negative transient voltage; piezoelectric transducer; reverse leakage current; robust thermal stability; size 1.0 mum; transducer driver; upper-side power transistors; Capacitors; Logic gates; Switches; Switching circuits; Temperature measurement; Transducers; Transient analysis; Bootstrap circuit; Bootstrap switch; High temperature; High voltage; SOI process; Transducer Driver;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuits (ISIC), 2014 14th International Symposium on
Conference_Location :
Singapore
Type :
conf
DOI :
10.1109/ISICIR.2014.7029480
Filename :
7029480
Link To Document :
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