Title :
ASIC front-end for sensing MEMS-mirror position
Author :
Chemmanda, L.J. ; Jianrong, C.C. ; Singh, R.P. ; Roterman, Y.
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
Capacitive sensing circuit for MEMS mirror based pico-projector scanning system is realized in this work. Two dimensional (2D) movements of the MEMS-mirror produce capacitive variations ΔCx and ΔCy. These are sensed and used to monitor and control the mirror movements in a closed feedback loop. The 2D mirror movement is produced using dual-actuation mechanism. High-voltage electro-static actuation is used for the horizontal movement (X-axis) and electro-magnetic actuation is used for the vertical movement (Y-axis). The high-voltage noise from the XSENSE couples into the YSENSE via the proof-mass (PM) and through other parasitic elements present in the MEMS device. The high-voltage noise is found to be the limiting factor for YSENSE resolution. Multi-pronged approach is used to suppress the high-voltage noise. High resolution temporal and position sensing for XSENSE and YSENSE respectively are successfully demonstrated.
Keywords :
application specific integrated circuits; capacitive sensors; circuit feedback; closed loop systems; electromagnetic actuators; electrostatic actuators; integrated circuit noise; interference suppression; micromechanical devices; 2D mirror movement; ASIC front-end; MEMS-mirror position sensing; XSENSE; YSENSE; application-specific integrated circuit; capacitive sensing circuit; capacitive variation; closed feedback loop; dual-actuation mechanism; electromagnetic actuation; high-voltage electrostatic actuation; high-voltage noise suppression; horizontal sensing; microelectromechanical system; multipronged approach; parasitic element; picoprojector scanning system; proof-mass; vertical sensing; Actuators; Capacitance; Clocks; Micromechanical devices; Mirrors; Noise; Sensors; 2D position sensing; Capacitive sensing; MEMS-mirror; pico-projector;
Conference_Titel :
Integrated Circuits (ISIC), 2014 14th International Symposium on
Conference_Location :
Singapore
DOI :
10.1109/ISICIR.2014.7029484
