Title :
A multilayered package technology for MMICs
Author :
Ida, M. ; Nishikawa, T.
Author_Institution :
Murata Mfg. Co., Ltd., Yokohama, Japan
fDate :
June 28 1993-July 2 1993
Abstract :
Three packaging technologies are introduced. An MCF (multilayer ceramic frame) single-cavity package shows high performance to Ka-band. An advanced MCF multiple-cavity package exhibits high performance of 26 GHz receiver. A microwave MCM (multichip module) made of BAS substrate demonstrates high performance of the L-band amplifier.<>
Keywords :
MMIC power amplifiers; ceramic insulation; integrated circuit packaging; microwave receivers; multichip modules; substrates; 26 GHz; BaO-Al/sub 2/O/sub 3/-SiO/sub 2/ ceramic; Ka-band; L-band amplifier; MMICs; microwave MCM; multichip module; multilayer ceramic frame; multilayered package technology; multiple-cavity package; single-cavity package; Ceramics; Conducting materials; Coplanar waveguides; Dielectric losses; Dielectric substrates; Frequency; Insertion loss; MMICs; Nonhomogeneous media; Packaging;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1993. AP-S. Digest
Conference_Location :
Ann Arbor, MI, USA
Print_ISBN :
0-7803-1246-5
DOI :
10.1109/APS.1993.385177
