• DocumentCode
    254588
  • Title

    Internet of Things: Trends, challenges and applications

  • Author

    Kiat Seng Yeo ; Chian, M.C. ; Ng, T.C.W. ; Do Anh Tuan

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2014
  • fDate
    10-12 Dec. 2014
  • Firstpage
    568
  • Lastpage
    571
  • Abstract
    This paper gives an overview of the trends, challenges and applications of the Internet of Things (IoT). It is paving the way towards a smart, interconnected world with infinite opportunities. The multidisciplinary scenario of internet, wireless sensor networks and data fusion which computational intelligence is distributed throughout the physical environment will enable new breeds of services, applications and systems. IoT is the next driver for electronics, in particular IC design in the IoT era will change and shape semiconductor innovation and manufacturing. An “IC design in cloud” is proposed as a turnkey infrastructure for IoT development.
  • Keywords
    Internet of Things; circuit CAD; cloud computing; integrated circuit design; IC design; Internet of Things; IoT development; cloud computing; semiconductor innovation; semiconductor manufacturing; Cloud computing; Companies; Integrated circuits; Internet of things; Market research; Wireless sensor networks; IC Design in Cloud; Internet of Everything; Internet of Things;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits (ISIC), 2014 14th International Symposium on
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/ISICIR.2014.7029523
  • Filename
    7029523