Title :
An improved SPICE model of phase-change memory (PCM) for peripheral circuits simulation and design
Author :
Yiqun Wei ; Xinnan Lin
Author_Institution :
Sch. of Electron. & Comput. Eng., Peking Univ., Shenzhen, China
Abstract :
An improved SPICE model is presented in this work, including three coupled modules, the electrical module, thermal module and the phase transition dynamic module. Considering the heterogeneous temperature distribution, a temperature distribution model and a distributed resistor network model based on the semispherical hypothesis of the active area are achieved. The model is submitted by Verilog-A language, and the peripheral drive circuit combined with the PCM cell is simulated. The results show a good fit with measurement. According to the simulation, the peripheral circuit for PCM cells with different structure is optimized.
Keywords :
SPICE; circuit simulation; driver circuits; hardware description languages; integrated circuit design; integrated circuit modelling; phase change memories; resistors; temperature distribution; PCM cell; Verilog-A language; distributed resistor network model; electrical module; heterogeneous temperature distribution model; improved SPICE model; peripheral drive circuit design; peripheral drive circuit simulation; phase transition dynamic module; phase-change memory; semispherical hypothesis; thermal module; Integrated circuit modeling; Phase change materials; Resistors; SPICE; Temperature measurement; Thermal resistance; Phase-Change Memory; Resistor Network; SPICE Model; nucleation/growth theory;
Conference_Titel :
Integrated Circuits (ISIC), 2014 14th International Symposium on
Conference_Location :
Singapore
DOI :
10.1109/ISICIR.2014.7029548
