• DocumentCode
    2546805
  • Title

    Photovoltaic array environmental protection program

  • Author

    Bilger, Kevin M. ; Gjerde, Helen B. ; Sater, Bemard L.

  • Author_Institution
    Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
  • fYear
    1989
  • fDate
    6-11 Aug 1989
  • Firstpage
    361
  • Abstract
    During the photovoltaic array environmental protection program, a coating material, application technique, and design approach intended to protect flexible solar array blankets during a nominal fifteen-year operating lifetime were developed. Numerous thin-film coatings for protecting the Kapton polyimide material used in the construction of the Space Station Freedom flexible solar array blanket were evaluated. The critical solar array design features and protection measures are discussed with special emphasis on the effects of solar array fabrication and flexible printed circuit manufacturing processes on coating durability. The results of the mechanical and environmental test evaluation, including oxygen plasma, neutral oxygen beam, and UV/charged-particle combined exposure, are discussed. These results led to the selection of a silicon dioxide thin-film coating to protect the solar array blanket from the low-earth-orbit atomic oxygen environment
  • Keywords
    solar cell arrays; space vehicle power plants; Kapton polyimide material; Space Station Freedom; atomic oxygen environment; coating material; environmental test evaluation; flexible printed circuit manufacturing processes; flexible solar array blankets; low-earth-orbit; mechanical test evaluation; photovoltaic array environmental protection; solar array fabrication; thin-film coatings; Building materials; Coatings; Fabrication; Photovoltaic systems; Plasma measurements; Polyimides; Protection; Solar power generation; Space stations; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1989. IECEC-89., Proceedings of the 24th Intersociety
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IECEC.1989.74488
  • Filename
    74488