• DocumentCode
    2547704
  • Title

    Study of surface effects in the operation of 3D microstrip detectors with ultra-thin silicon substrates

  • Author

    Balbuena, J.P. ; Pellegrini, Giulio ; Fleta, Celeste ; Garcia, Francisco ; Guardiola, Consuelo ; Lozano, Manuel ; Quirion, D. ; Ullan, M.

  • Author_Institution
    Inst. Nac. de Microelectron., CNM, Barcelona, Spain
  • fYear
    2012
  • fDate
    Oct. 27 2012-Nov. 3 2012
  • Firstpage
    940
  • Lastpage
    943
  • Abstract
    U3DTHIN silicon is a proficient candidate for the particle analyzers for plasma diagnosis for the future ITER fusion reactor. The low full depletion of the 3D electrodes geometry implemented in these detectors as well as their low capacitances make them suitable for the tasks of ion detection they are being proposed in this work. Their electrical properties have been simulated in different configurations to know their working behavior. Both aluminum strips and oxide surface charge play important roles in the electrical behavior of these detectors. The field plate effect provided by the metallizations makes the potential and electric field to have distributions parallel to the aluminum strips, while the electron channels formed by electrons attracted by the positive charge located at the Si/SiO2 interface make the detectors require higher voltages to deplete those inversion layers to effectively fully deplete the sensors. This surface effect is more important if the sensor is thinner due to the proximity of both top and bottom electron layers.
  • Keywords
    proportional counters; silicon radiation detectors; 3D electrodes geometry; 3D microstrip detectors; ITER fusion reactor; Si-SiO2; U3DTHIN silicon; aluminum strips; bottom electron layer; field plate effect; ion detection; oxide surface charge; plasma diagnosis; surface effect study; top electron layer; ultra-thin silicon substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    1082-3654
  • Print_ISBN
    978-1-4673-2028-3
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2012.6551245
  • Filename
    6551245