• DocumentCode
    2548767
  • Title

    Designing high voltage modularized assemblies for high altitude environments

  • Author

    Belnap, Carl I.

  • Author_Institution
    Unisys Corp., Salt Lake City, UT, USA
  • fYear
    1989
  • fDate
    6-11 Aug 1989
  • Firstpage
    429
  • Abstract
    Several important design and analysis criteria for modularizing high-voltage power supplies for traveling wave tubes and klystrons which operate in high-altitude aerospace environments are discussed. Among the criteria discussed are those relating to design for life, thermal coefficient of expansion, thermal conductivity, shielding, and minimizing corona. Thermal conductivity and thermal coefficient of expansion measurements of a silicone material containing alumina filler are presented and compared to values obtained for the original material without filler
  • Keywords
    aerospace instrumentation; klystrons; power supplies to apparatus; thermal conductivity; thermal expansion; travelling-wave-tubes; alumina filler; corona minimisation; high voltage modularized assemblies; high-altitude aerospace environments; high-voltage power supplies; klystrons; shielding; silicone material; thermal coefficient of expansion; thermal conductivity; traveling wave tubes; Aerospace materials; Assembly; Conducting materials; Conductivity measurement; Corona; Klystrons; Power supplies; Thermal conductivity; Thermal expansion; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1989. IECEC-89., Proceedings of the 24th Intersociety
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IECEC.1989.74498
  • Filename
    74498