DocumentCode
2548767
Title
Designing high voltage modularized assemblies for high altitude environments
Author
Belnap, Carl I.
Author_Institution
Unisys Corp., Salt Lake City, UT, USA
fYear
1989
fDate
6-11 Aug 1989
Firstpage
429
Abstract
Several important design and analysis criteria for modularizing high-voltage power supplies for traveling wave tubes and klystrons which operate in high-altitude aerospace environments are discussed. Among the criteria discussed are those relating to design for life, thermal coefficient of expansion, thermal conductivity, shielding, and minimizing corona. Thermal conductivity and thermal coefficient of expansion measurements of a silicone material containing alumina filler are presented and compared to values obtained for the original material without filler
Keywords
aerospace instrumentation; klystrons; power supplies to apparatus; thermal conductivity; thermal expansion; travelling-wave-tubes; alumina filler; corona minimisation; high voltage modularized assemblies; high-altitude aerospace environments; high-voltage power supplies; klystrons; shielding; silicone material; thermal coefficient of expansion; thermal conductivity; traveling wave tubes; Aerospace materials; Assembly; Conducting materials; Conductivity measurement; Corona; Klystrons; Power supplies; Thermal conductivity; Thermal expansion; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Engineering Conference, 1989. IECEC-89., Proceedings of the 24th Intersociety
Conference_Location
Washington, DC
Type
conf
DOI
10.1109/IECEC.1989.74498
Filename
74498
Link To Document