DocumentCode :
2549341
Title :
Interactions between phases and thermal stability of TiBx(ZrBx)-n-SiC 6H contacts
Author :
Boltovets, N.S. ; Ivanov, V.N. ; Abdizhaliev, S.K. ; Konakova, R.V. ; Kudrik, Ya.Ya. ; Lytvyn, P.M. ; Lytvyn, O.S. ; Milenin, V.V. ; Rengevych, O.E. ; Venger, E.F. ; Vlaskina, S.I.
Author_Institution :
Sci. & Res. Inst. "Orion", Kiev, Ukraine
fYear :
2002
fDate :
14-16 Oct. 2002
Firstpage :
95
Lastpage :
98
Abstract :
We present the results of our investigations of morphological and electrical characteristics of TiBx(ZrBx)-n-SiC 6H (0001) surface-barrier structures. They were studied both before and after rapid thermal annealing (RTA) in vacuum at 1000°C for 90 s. The TiBx (ZrBx) films were obtained using magnetron sputtering from pressed targets of stoichiometric composition. It was shown that RTA changed neither the contact layered structure nor the abrupt shape of the interface, and the contact barrier properties were retained.
Keywords :
Schottky barriers; contact resistance; interface structure; rapid thermal annealing; silicon compounds; sputtered coatings; stoichiometry; thermal stability; titanium compounds; wide band gap semiconductors; zirconium compounds; 1000 degC; 90 s; RTA; SiC; TiBx(ZrBx)-n-SiC 6H contacts; TiBx-SiC; ZrBx-SiC; contact barrier properties; contact structure; electrical characteristics; interface; magnetron sputtering; morphological characteristics; phases; rapid thermal annealing; surface-barrier structures; thermal stability; vacuum; Atomic force microscopy; Electrons; Gold; Nickel; Schottky barriers; Schottky diodes; Silicon carbide; Temperature; Testing; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Devices and Microsystems, 2002. The Fourth International Conference on
Print_ISBN :
0-7803-7276-X
Type :
conf
DOI :
10.1109/ASDAM.2002.1088484
Filename :
1088484
Link To Document :
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