Title :
Effect of mechanical deformations on thermally stimulated currents in polymers. I. Uniaxially cold-drawn polycarbonate
Author :
Yianakopoulos, G. ; Vanderschueren, J. ; Niezette, J.
Author_Institution :
Dept. of Macromolecular & Phys. Chem., Liege Univ., Belgium
Abstract :
The thermally stimulated depolarization and polarization current (TSDC and TSPC) methods have been used to study the intermediate relaxation induced in polycarbonate by uniaxial cold drawing at various drawing ratios and rates. No spontaneous polarization resulting from molecular orientation or internal stress was evidenced by current measurements under zero bias voltage. The intermediate α´ relaxation was generated in TSPC and subsequent TSDC experiments, but its properties were markedly different in the two types of spectra. In TSPC measurements, the molecular mechanism responsible for the α´ peak is probably a field-induced local orientation of chain segments made possible by the increase in free volume consecutive to the drawing process. During this polarization step, which involves a thermal treatment of the drawn material up to 100°C, a progressive change in structure and dipolar environment occurs, and this tends to shift and broaden the relaxation as seen in subsequent TSDC cycles
Keywords :
anelastic relaxation; drawing (mechanical); heat treatment; internal stresses; plastic deformation; polymer structure; polymers; thermally stimulated currents; α´ relaxation; 100 C; chain segments; dipolar environment; field-induced local orientation; intermediate relaxation; internal stress; mechanical deformations; molecular orientation; polarization current; polycarbonate; polymers; structure; thermal treatment; thermally stimulated currents; thermally stimulated depolarization; uniaxial cold drawing; zero bias voltage; Chemistry; Dielectric measurements; Glass; Internal stresses; Polarization; Polymers; Reproducibility of results; Residual stresses; Temperature distribution; Volume relaxation;
Conference_Titel :
Electrets, 1988. (ISE 6) Proceedings., 6th International Symposium on (IEEE Cat. No.88CH2593-2)
Conference_Location :
Oxford
DOI :
10.1109/ISE.1988.38536