Multi-wire fast slicing for photovoltaic applications

The feasibility of slicing 100 mm×100 mm silicon with the multiwire fixed abrasive slicing technique (FAST) was first established with a single-headed R&D FAST slicer. Based on these results, a high throughput double-headed FAST slicer has been designed, fabricated, and tested for slicing 100-mm-square multicrystalline silicon bars. A central drive system is utilized for reciprocating two slicing heads, one on either end. Each slicing head is capable of slicing 100 mm×100 mm or 125 mm×125 mm cross-section silicon bars up to 38 cm in length. Effective slicing of 100 mm×100 mm silicon bars has been demonstrated on a production basis