DocumentCode :
254954
Title :
Keynote: “High throughput computing data center”
Author :
Qinfen Hao
Author_Institution :
Shannon Lab., Huawei Corp. Res., China
fYear :
2014
fDate :
20-22 Aug. 2014
Firstpage :
1
Lastpage :
1
Abstract :
Over the last few decades, data center (DC) technology has evolved from DC 1.0 (tightly-coupled silos) to DC 2.0 (computer virtualization) in order to enhance data processing capability. In the era of big data, highly diversified analytics applications stress data centers. The mounting requirements on throughput, resource utilization, manageability and energy efficiency demand seamless integration of heterogeneous system resources to adapt to varied big data applications, for which DC 2.0 does not sufficient. By rethinking the challenges of big data applications, Huawei proposes High Throughput Computing Data Center architecture (HTC-DC) toward the design of DC 3.0. HTC-DC features resource disaggregation via unified interconnection. It offers PB-level data processing capability, intelligent manageability, high scalability and high energy efficiency, hence a promising candidate for DC 3.0.
Keywords :
Big Data; computer centres; virtualisation; DC 1.0; DC 2.0; DC 3.0; DC technology; HTC-DC; Huawei; PB-level data processing capability; big data applications; computer virtualization; data center technology; energy efficiency demand seamless integration; heterogeneous system resources; high throughput computing data center architecture; intelligent manageability; resource utilization; stress data centers; Big data; Computer architecture; Computers; Optical interconnections; Servers; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Embedded and Real-Time Computing Systems and Applications (RTCSA), 2014 IEEE 20th International Conference on
Conference_Location :
Chongqing
Type :
conf
DOI :
10.1109/RTCSA.2014.6910494
Filename :
6910494
Link To Document :
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