• DocumentCode
    2549661
  • Title

    A pulse-echo ultrasonic technique for the localization of the solid-liquid interface during directional solidification of silicon ingots

  • Author

    Eyer, A. ; Haas, F. ; Schätzle, P. ; Räuber, A. ; Knobel, R.M.

  • Author_Institution
    Fraunhofer-Inst. fuer Solare Energiesyst., Freiburg, Germany
  • fYear
    1991
  • fDate
    7-11 Oct 1991
  • Firstpage
    982
  • Abstract
    A special ultrasonic technique is discussed and experiments in a solidification process for 24 kg ingots are reported. The ultrasonic signal is generated and received by the same piezoelectric transducer. As direct contact of the transducer with the silicon melt is impossible, a transmission rod is used. It is dipped into the melt at one end, and bears the transducer at its cold end. This rod is the most critical part of the system. Several materials were under consideration, and some of them were tested. Clear echoes from the solid-liquid interface were received with transmission rods made of SiC, Al2O3, and monocrystalline Si
  • Keywords
    directional solidification; elemental semiconductors; piezoelectric transducers; silicon; ultrasonic materials testing; ultrasonic transducers; Al2O3; Si ingots; SiC; directional solidification; monocrystalline Si; piezoelectric transducer; pulse-echo ultrasonic technique; solid-liquid interface; transmission rod; Piezoelectric transducers; Production; Radiography; Silicon; Solids; Surface emitting lasers; Temperature; Ultrasonic imaging; Ultrasonic transducers; Velocity control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1991., Conference Record of the Twenty Second IEEE
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-87942-636-5
  • Type

    conf

  • DOI
    10.1109/PVSC.1991.169356
  • Filename
    169356