Title :
Spline Interpolation Uesed in Electronchemical Impedance Spectroscopy
Author :
Feng, Zhe-sheng ; Sun, Bao-rui ; Ding, Jia ; Liang, Zi
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci.&Technol. of China, Chengdu
Abstract :
Electrochemical impedance spectroscopy (EIS) is one of the important means in the study of surface dynamics during complex electrodes reaction. Two signal techniques are used in the EIS: the frequency-domain and time-domain techniques. Electrochemical impedance spectroscopy measurement based on the fast Fourier transformation (FFT), which can probe transient electrochemical processes, is highly regarded in recent years because of its significant advantages, such as small disturbances to the electrochemical systems, high test speed, and accurate result in the low-frequency test. However, problems involving signal procession have always existed, such as unperfect signal period. This paper focuses primarily on the signal reconstruction step before the FFT processing. In this paper, the cubic spline interpolation will be used and discussed.
Keywords :
electrochemical electrodes; electrochemical impedance spectroscopy; fast Fourier transforms; frequency-domain analysis; interpolation; signal reconstruction; splines (mathematics); surface dynamics; time-domain analysis; FFT processing; complex electrodes reaction; cubic spline interpolation; electrochemical impedance spectroscopy; electrochemical systems; fast Fourier transformation; frequency-domain techniques; signal procession; signal reconstruction; signal techniques; surface dynamics; time-domain techniques; transient electrochemical processes; Electrochemical impedance spectroscopy; Electrodes; Impedance measurement; Interpolation; Signal processing; Spline; Surface impedance; System testing; Time domain analysis; Velocity measurement; FFT-EIS; cubic spline interpolation; electrode reaction; signal processing;
Conference_Titel :
Apperceiving Computing and Intelligence Analysis, 2008. ICACIA 2008. International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-3427-5
Electronic_ISBN :
978-1-4244-3426-8
DOI :
10.1109/ICACIA.2008.4769961