Title :
Development of student innovation skills through industry-university research collaboration
Author_Institution :
ECE Dept., Univ. of Massachusetts, Lowell, MA, USA
Abstract :
When university groups are involved in joint R&D projects with industrial companies, students learning is intensified and focused on practical aspects of design and fabrication of electronic components and systems. In current presentation we discuss the development of specific skills which undergraduate and graduate students of UMass do acquire in development of RF technology working closely with engineering teams of companies such as MACOM Technology Solutions, RF Micro Devices, Raytheon and others. Students coming to a company site should possess a strong knowledge in solid-state and quantum electronics, RF circuitry design, and device processing. As interns with a company their learning starts with discussion of potential products under development. Before sending a wafer to processing students need to understand the entire set of technical parameters, and processing technology used in production. After first experimental wafer is tested, the most crucial step is to find the ways to improve the performance of a product by re-designing the component and the circuitry, attempting to change the fabrication, if possible. It is at that step the creative thinking most often generates new ideas and patents.
Keywords :
educational institutions; electronic engineering education; innovation management; MACOM technology solutions; R&D projects; RF circuitry design; RF microdevices; RF technology; Raytheon; UMass; industrial companies; industry-university research collaboration; quantum electronics; solid-state electronics; student innovation skills; Circuit testing; Collaboration; Electronic components; Electronics industry; Fabrication; Process design; Radio frequency; Solid state circuits; Technological innovation; Textile industry; Technological innovation; amplifiers; switches; transistors;
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2009.5165675