Title :
Innovative metrics for machine performance measurement and their applications in semiconductor manufacturing
Author :
Wang, Qiang ; Li, Bo
Author_Institution :
Inst. of Astronaut. & Aeronaut., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
Reasonable metrics to measure machine performance are appropriate benchmarks for maintenance. The most popular machine performance metrics machine availability (MA) has been found that it is not suitable for all the situations. After scheduled downtime was excluded from the analysis, machine performance (MP) and machine failure (MF) were proposed. A case study demonstrates that the proposed two metrics can reflect the machine performance induced by machine self more accurately than MA. Correlation analysis validates the deduction that the difference between MF and 1-MA is less with the growth of the length of the selected period. MA was not denied in all areas because it can be used in catching the total available time of machine or catching the machine performance of a long time. The results of two applications (machine downtime control and performance measurement of preventative maintenance) show the proposed two metrics can work well to measure the machine performance.
Keywords :
failure analysis; machinery; semiconductor device manufacture; statistical analysis; correlation analysis; innovative metrics; machine downtime control; machine failure; machine performance measurement; preventative maintenance; semiconductor manufacturing; Appropriate technology; Availability; Costs; Extraterrestrial measurements; Job shop scheduling; Performance analysis; Performance evaluation; Production; Semiconductor device manufacture; Space technology; Metrics; machine availability; machine failure; machine performance; measurement;
Conference_Titel :
Industrial Engineering and Engineering Management, 2009. IE&EM '09. 16th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-3671-2
Electronic_ISBN :
978-1-4244-3672-9
DOI :
10.1109/ICIEEM.2009.5344480