DocumentCode :
2550710
Title :
Low-loss and low-cost solution for printed transmission lines at millimeter-wavelengths by using bilaterally metal-loaded tri-plate transmission line
Author :
Kuroki, Futoshi ; Tamaru, Ryo-ji
Author_Institution :
Kure Nat. Coll. of Technol., Kure, Japan
fYear :
2009
fDate :
7-12 June 2009
Firstpage :
301
Lastpage :
304
Abstract :
Since surfaces of dielectric substrates for printed boards are usually roughened to make tight copper-coating, it was found out that an effective conductivity of a surface of the copper foil, attaching on the dielectric substrate, more degraded than that of an opposite surface of the copper foil, facing an air region, beyond centimeter frequencies. The transmission loss therefore degrades due to the roughness of the copper foil surface. On the other side, it is confirmed that the current density on the under surface of the copper foil decreases by symmetrically-loading metal patterns on both sides of the dielectric substrate and by biasing an equi-voltage to both metal patterns, and thus the transmission loss is relatively unaffected by the roughness of the dielectric surfaces. Based on this consideration, a bi-laterally metal-loaded tri-plate transmission line was evaluated by using a cheap FR-4 substrate, being poor material for use as millimeter-wave lengths but being cost-effective.
Keywords :
Q-factor; millimetre wave devices; parallel plate waveguides; printed circuits; surface roughness; Q-factor; bilaterally metal-loaded triplate transmission line; copper foil surface; current density; dielectric substrates; millimeter-wavelength; parallel metal plate waveguide; printed board; printed transmission lines; symmetrically-loading metal pattern; transmission loss; Conductivity; Copper; Degradation; Dielectric losses; Dielectric substrates; Joining processes; Propagation losses; Rough surfaces; Surface roughness; Transmission lines; Low transmission loss; Printed transmission line; microwaves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
Conference_Location :
Boston, MA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-2803-8
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2009.5165693
Filename :
5165693
Link To Document :
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