DocumentCode
2551143
Title
Silicon sensors for HL-LHC tracking detectors
Author
Kuehn, S.
Author_Institution
Inst. of Phys., Albert-Ludwigs Univ. of Freiburg, Freiburg, Germany
fYear
2012
fDate
Oct. 27 2012-Nov. 3 2012
Firstpage
1653
Lastpage
1656
Abstract
It is foreseen to significantly increase the luminosity of the Large Hadron Collider (LHC) at CERN by upgrading it towards the HL-LHC (High Luminosity-LHC) in order to harvest the maximum physics potential of the machine. This will result in high radiation doses for the tracking detectors. Due to the radiation damage limitations of the silicon sensors presently used, the physics experiments will require new tracking detectors for HL-LHC operation. Within the CERN RD 50 Collaboration, a research and development programme is underway across LHC Experiments boundaries to develop silicon sensors with sufficient radiation tolerance. Some of the most recent RD 50 results are presented in this paper and examples of the different research fields of RD 50 are given. Amongst these are the studies of defects and electric field measurements in devices and the performance of planar and 3D detectors before and after irradiation to doses expected at the HL-LHC. They demonstrate that the 3D technology has become a reliable option for LHC-Upgrades. In addition, observations of charge multiplication effects at very high bias voltages in a number of detectors and studies to investigate it further are reported. The paper concludes with a few achievements of the RD 50 Collaboration in light of the LHC experiments.
Keywords
silicon radiation detectors; 3D detectors; CERN RD 50 Collaboration; HL-LHC operation; HL-LHC tracking detectors; LHC experiments; LHC-upgrades; Large Hadron Collider; charge multiplication effect; electric field measurements; high-bias voltage; high-radiation doses; physics experiments; radiation damage; radiation tolerance; silicon sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE
Conference_Location
Anaheim, CA
ISSN
1082-3654
Print_ISBN
978-1-4673-2028-3
Type
conf
DOI
10.1109/NSSMIC.2012.6551392
Filename
6551392
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